BAKU New Product A8/A9/A10 Universal BGA Mobile IC Reballing Stencil For iphone 6/6plus /6s/6splus /7/7plus
1.Stepped groove design enables stencil to align with tinning position of IC rapidly.
2.The square holes design makes it easier to take out the formed solder balls.
3.This 3D stencil is easy to use no matter you are a new or expert.
4.High success rate of planting tin,the solder balls can be formed once after you are proficient.
5.This 3D planting stencil is thicker than ordinary stencil in the market.Less tendency of deformation makes its using life be longer.
1. What is the minimum order quantity (MOQ) for products?Generally according to the requirements of customers, no matter how many we can accept.2. How long is the product warranty?We guarantee 3 months for domestic customers; and 3 months for oversea customers but they bear the freight fee or repair some accessories for secondary purchase. 3. What's the advantage of your products?A: 11 years of experience in production and sales, with independent brand complete variety of products of repair industry. 4. Are you accept OEM order?Yes, of course, but we have quantity requirement, please feel free to contact our staff for details. 5. What about delivery day?For sample with existing products, delivery within 3 days; and for customer order products in great quantity, 7 to 15 days. Generally 20-30 days for customer OEM products.6. How about terms of payment?A: T/T, PayPal, Western Union, Money Gram, L/C, etc.